Method for manufacturing led array head and led array head prepared by using the same
US6461883B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2000 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Oct 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An LED array head for an electrophotographic system includes a base plate mounting thereon a number of linearly arranged LED chips and a support member holding the base plate. The base plate and the support member are bonded together by means of a principal adhesive agent which is elastic after hardening such as a silicone type and an auxiliary adhesive agent which hardens more quickly and is less elastic after hardening than the principal adhesive agent. An ultraviolet ray setting type adhesive agent is preferably used as the auxiliary adhesive agent. Assembling steps of such LED array heads can proceed without waiting for hardening of the principal adhesive agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.