Semiconductor chip removing and conveying method and device
US6461942B2 · kind B2 · utility
11Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2000 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Dec 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6839
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor chips are formed on a wafer. The wafer is diced, while a dicing tape applied to the wafer is kept intact. Each of the semiconductor chips is fixed by suction and then removed from the dicing tape. Each of the semiconductor chips is unfixed by ceasing the suction and picked up and conveyed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.