Photoimageable compositions and films for printed wiring board manufacture
US6462107B1 · kind B1 · utility
18Cited by
36References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1998 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Dec 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Compositions for forming polymeric layers useful in the manufacture printed wiring boards and other electrical interconnecting devices are disclosed. The compositions typically are processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compound. The compositions are particularly useful in the manufacture of laminable films used to make printed wiring boards. Multilayer printed wiring boards made using such films, and methods for making and using the films and boards, also are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.