Adhesive film of quinoline polymer and bismaleimide
US6462148B1 · kind B1 · utility
9Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1999 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Oct 7, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6′-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4′-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.