System and method for material processing using multiple laser beams
US6462306B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2000 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Apr 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A material machining system for machining a workpiece (PCB, PWB etc.) for drilling blind vias. The system includes a laser supply system (20, 26, 30) for supplying discrete machining beams (22a, 22b) that are separate from each other. A deflecting devices (28, 32) is provided for deflecting each of the discrete machining beams to generate multiple independent beams at a plurality of positions within a field of operation on the workpiece. A scan lens (34) having an entrance pupil configured to receive the multiple independent beams from the deflecting devices is provided proximate to the entrance pupil of the scan lens. A computer is used for controlling the deflecting devices to change the respective positions of the multiple independent beams in at least one co-ordinate direction within the field of operation. The deflecting devices include galvo/mirror pairs at the entrance pupil of the scan lens. This is accomplished since the scan lens has a relatively large entrance pupil and the mirror parts are small. The advantage of this arrangement is the ability of all beams to access a full working field (typically 2×2 inches) on the workpiece simultaneously, so that the highest e…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.