Semiconductor wafer processing apparatus for transferring a wafer mount
US6462411B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1998 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Dec 4, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer processing apparatus comprises a reaction furnace capable of heating inside thereof, a wafer mount for mounting a semiconductor wafer thereon and a transfer device. The wafermount includes an opening which is greater than the semiconductor wafer and which has a circle shape or a shape substantially similar to an outer periphery of the semiconductor wafer, and includes a wafer supporting portion projecting inwardly of the opening for supporting the semiconductor wafer. The transfer device is capable of holding the wafer mount outside the semiconductor wafer as viewed from a vertical direction, and transferring the wafer mount carrying the semiconductor wafer thereon substantially horizontally into and/or out from the reaction furnace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.