Semiconductor device and manufacturing method thereof
US6462425B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1999 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Oct 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device allowing a mounting of a semiconductor substrate with narrow electrode pad interval on an insulated circuit board while securing a favorable insulation characteristic and a manufacturing method thereof are obtained. The semiconductor device includes an electrode pad formed on a semiconductor substrate; a connecting underlying metal film connected to the electrode pad; a connecting conductor establishing electrical conduction between the connecting underlying metal film and a terminal electrode on an insulated circuit board; and non-conductive resin surrounding the connecting conductor and filling a gap between the substrate and the insulated circuit board. Here, the connecting underlying metal film is not covered by the connecting conductor at least in a peripheral region including an outer peripheral portion thereof
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.