Semiconductor chip, set of semiconductor chips and multichip module
US6462427B2 · kind B2 · utility
12Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Dec 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Each bare-chip IP includes pad electrodes that are of the same size and shape, made of the same material, and arranged in an array at the same pitch over almost the entire surface thereof. A silicon wiring substrate includes pad electrodes that are arranged in an array over almost the entire surface thereof at the same pitch as that between the pad electrodes of the bare-chip IPs. The bare-chip IPs are mounted on the silicon wiring substrate, thereby making a multichip module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.