Multi-layer flat plate antenna with low-cost material and high-conductivity additive processing
US6462711B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2001 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Apr 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention is a multi-layer printed circuit antenna and a method for developing the antenna for which a screen printing technology is used to deposit conducting material forming the circuit layout directly on low-cost dielectric material, followed by a post-processing step performed on the printed circuit to increase circuit conductivity. In one embodiment, the dielectric material used is a thin layer supported by low-loss, foam-like material for spacing between the antenna layers. In another embodiment, a thick high-density, low-cost low-loss dielectric material acts as both the printing surface and the spacer between the antenna layers. The thick high-density, low-cost low-loss dielectric material allows for saving one layer in every printed circuit. The screen printing or additive process is less expensive than its etching or subtractive counterpart due to the process itself and due to the lower cost of materials. The post-processing of the printed circuit achieves the same level of conductivity as the more expensive etching technique. This allows for low-cost manufacturing for printed circuit antennas for use in, for example, DBS, DTH/TV, MMDS, LMDS and other wireless commun…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.