Thermal management system for a multiple processor computer appliance
US6462948B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2001 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Jun 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method for cooling multiple microprocessors located on a circuit board containing disk drives, memory and other components. This cooling system and method utilizes a blower connected to an air duct. The air duct is divided into several channels via the placement of one or more walls within their duct. Each channel of the air duct is connected to a separate heat sink affixed to each microprocessor. Ambient air blown into the air duct is divided among the channels and proceeds to absorb heat from each of the heat sinks prior to being expelled from the circuit board. The system and method utilizes minimal space on the circuit board and provides maximum cooling for each microprocessor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.