High performance orthogonal interconnect architecture without midplane
US6462957B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2000 |
| Grant date | Oct 8, 2002 |
| Priority date | — |
| Expiry date | Dec 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0239
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion having a plurality of circuit layers, including a first signal layer, and a first interconnection portion, including the first signal layer, for mating with a second interconnection portion of the second circuit board. The first circuit board also includes a flexible portion, including the first signal layer, for connecting the substantially rigid circuit portion to the first interconnection portion. The flexible portion allows the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the first circuit board and the second circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.