High density plasmas
US6463873B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 4, 2000 |
| Grant date | Oct 15, 2002 |
| Priority date | — |
| Expiry date | Apr 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high density plasma forming apparatus is configured to sputter material from a target unto a substrate. The apparatus comprises a process chamber, a target mounted within the process chamber, and a substrate mounted within the process chamber and configured to receive material sputtered from the target. The apparatus further includes a magnetic field generator by which the plasma may be directed unto the target, a side arm open to the process chamber, and a radio frequency antenna for forming a plasma in the side arm. The radio frequency antenna is a helical coil wound around the external surface of the side arm. In use, the plasma generated within the side arm enters the process chamber in a first direction and is deflected from an angle from the first direction within the process chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.