Lead frame tooling design for bleed barrier groove
US6465274B2 · kind B2 · utility
2Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2001 |
| Grant date | Oct 15, 2002 |
| Priority date | — |
| Expiry date | May 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for forming a stamped groove in a lead frame including a tool for coining the groove in the lead frame. The tool has a shoulder to control swelling of the lead frame surface near the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.