Hot melt pressure sensitive positioning adhesive
US6465557B1 · kind B1 · utility
15Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2000 |
| Grant date | Oct 15, 2002 |
| Priority date | — |
| Expiry date | Jun 22, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present invention is a hot melt pressure sensitive positioning adhesive for use with an absorbent article. The adhesive comprises:(a) from greater than 6 to less than 15 percent by weight of the total of (a), (b) and (c) of a hydrogenated styrene-(butadiene and/or isoprene)-styrene block copolymer having a vinyl content of greater than 50% by weight; and(b) from 50 to 80 percent by weight of the total of (a), (b) and (c) of a tackifying resin which has an aromaticity such that the MMAP cloud point is at least 45° C.; and(c) from 5 to 35 percent by weight of the total of (a), (b) and (c) of a plasticizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.