Solvent based adhesive composition
US6465558B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2001 |
| Grant date | Oct 15, 2002 |
| Priority date | — |
| Expiry date | Feb 5, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2467/006
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This invention relates to a solvent based adhesive composition including a major amount of a solvent system and a minor amount of an adhesive polymer system. The solvent system preferably includes a terpene and an aldehyde, ketone, or an aromatic solvent. The adhesive polymer system preferably includes one or a blend of polymers that dissolve, at least in part, in the solvent solution. The components of the solvent adhesive are compatible in that they do not separate upon standing. The solvent based adhesive composition provides good adhesion between polymer articles such as, for example, polyolefin and acrylic films, as well as good adhesion between polymeric articles and wood or metal substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.