Patent · US Expired

Laser joining method and a device for joining different workpieces made of plastic or joining plastic to other materials

US6465757B1 · kind B1 · utility

74Cited by
21References
16Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJan 20, 2000
Grant dateOct 15, 2002
Priority date
Expiry dateJan 20, 2020

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29L2031/756
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method and a device for laser joining of plastics or for joining plastics to other materials, which are brought into contact with pressure, with the workpiece closest to the laser beam source being largely transparent for the laser beam, and the second workpiece being as absorbent as possible. By producing a laser beam shaped in the form of a line on the contact surface between the workpieces and by a relative movement of the laser beam relative to the workpieces, designed according to the desired joint seam structure, the workpieces are bonded together accurately only in the desired joining areas. This permits a highly accurate bonding with the smallest possible joint seam distances, so that even parts for micro-systems engineering can also be produced with a short cycle time.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.