Wafer cleaning brush profile modification
US6467120B1 · kind B1 · utility
27Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1999 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Sep 8, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B1/34
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A wafer cleaning brush roller having uniform and non-uniform protrusions via compression. The protrusions are formed by an inner PVA sponge compressed through an outer sleeve formed of a resilient mesh that does not react with DI water or other CMP surfactants. Directional channeling of DI water is also provided to the protrusions. Edge cleaning of the wafer as accomplished by having a thicker brush extension at each end where the wafer's edge would rub and provide added cleaning capability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.