Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same
US6467138B1 · kind B1 · utility
40Cited by
24References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 24, 2000 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | May 24, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/2079
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
This invention is provided a method for making a backing layer for an ultrasonic matrix array transducer useful in diagnostic imaging, non-destructive material testing and treatment of human organs. The method includes placing the grid in a mold, filling the mold with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, curing the material in the mold so as to form a block formed by the cured absorbent material and the grid, and releasing the block from the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.