Refrigerated cooling apparatus for semiconductor device
US6467295B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2001 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Oct 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
The present invention relates to a refrigerated cooling apparatus for cooling heat generated from a semiconductor device by forming a circulating flow path of the air in a case with an evaporator and the semiconductor mounted.The refrigerated cooling apparatus includes a compressor for compressing a coolant at high pressure, a condenser, connected to the compressor, for condensing the coolant, an expansion valve connected to the condenser, an evaporator, connected to the expansion valve and the compressor, for evaporating the coolant, and a venting fan mounted on the evaporator, wherein the evaporator is integrally installed to the case forming a cooling space for a semiconductor device, and is connected to the compressor and the expansion valve provided on an exterior of the case through a connecting pipe; the venting fan is mounted on the evaporator to be divided from the semiconductor device; and a circulating flow path is formed in the case, so that a heat-transferred air of a low temperature absorbs a heat from the semiconductor device and flows to the evaporator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.