Method for manufacturing conductive thin film patterned substrate
US6468584B1 · kind B1 · utility
12Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2000 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Mar 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a conductive thin film patterned substrate which is capable of being practiced at a reduced cost without causing environmental pollution while eliminating any troublesome after-treatment. An insulating substrate made of glass or the like is formed thereon with an InSnO, SnSbO, ZnAlO or Al thin film. Then, a phosphate low-softening glass paste layer is formed on the thin film. A portion of the thin film contiguous to an insulating layer made of the low-softening glass paste melts into a glass region to form an insulating layer region, so that a conductive thin film region may be patterned as electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.