Plated non-conductive products and plating method for the same
US6468593B1 · kind B1 · utility
24Cited by
3References
12Claims
0Family size
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Inventors
Key dates
| Filing date | Nov 25, 1998 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Nov 25, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to 80 weight %, and (b) a conductive whisker in 80 to 20 weight %; and executing electroless plating on a surface of the coating film. Also provided are products produced by this method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.