Web process interconnect in electronic assemblies
US6468638B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1999 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Mar 16, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.