Method for patterning organic thin film devices using a die

US6468819B1 · kind B1 · utility

Assignee

• THE TRUSTEES OF PRINCETON UNIVERSITY · US

Inventors

• Changsoon Kim · Princeton, US
• Paul E. Burrows · Chattaroy, US
• Stephen R. Forrest · Ann Arbor, US
• Theodore Zhou · Princeton, US

Key dates

• Filing date: Nov 21, 2000
• Grant date: Oct 22, 2002
• Expiry date: Nov 21, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K71/221

Abstract

The present invention relates to patterning methods for organic devices, and more particularly to patterning methods using a die. A first layer of organic materials is deposited over a substrate, followed by a first electrode layer. A first patterned die having a raised portion is then pressed onto the first electrode layer, such that the raised portion of the first patterned die contacts portions of the first electrode layer. The patterned die is removed, such that the portions of the first electrode layer in contact with the raised portions of the first patterned die are removed. In one embodiment of the invention, a second organic layer is then deposited over the first electrode layer, followed by a second electrode layer. A second patterned die having a raised portion is pressed onto the second electrode layer, such that the raised portion of the second patterned die contacts portions of the second electrode layer. The second patterned die is removed, such that the portions of the second electrode layer in contact with the raised portions of the second patterned die are removed. Preferably the patterned die is coated with an adhesive material such as a metal.