Method of forming structure having surface roughness due to nano-sized surface features
US6468916B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2001 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Jan 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J9/025
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming a micro structure having nano-sized surface features is provided. The method includes the steps of forming a micro structure having predetermined size and shape on a substrate, coating a carbon polymer layer on the substrate including the micro structure to a predetermined thickness, performing a first etch on the carbon polymer layer by means of plasma etching using a reactive gas in which O2 gas for etching the carbon polymer layer and a gas for etching the micro structure are mixed and forming a mask layer by the residual carbon polymer layer on the surface of the micro structure, and performing a second etch by means of plasma etching using the mixed reactive gas to remove the mask layer and etch the surface of the micro structure not covered by the mask layer so that the micro structure has nano-sized surface features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.