Oblique angle laser shock processing
US6469275B2 · kind B2 · utility
10Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2001 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | May 18, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/356
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for improving properties of a solid material by providing shockwaves therethrough. The method includes controlling the incident angle &THgr; of the laser beam applied to the workpiece so that the required residual stresses are created in the workpiece. Particular methods of control such as lenses, polarizers, and particular transparent overlay geometries are shown. The apparatus includes structure for controlling the position and incident angle of the laser beam then controlling the polarization and/or the shape of the incident impact area, based on such incident angle &THgr; or thickness of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.