Heat absorbent for an infrared sensor and method for forming same
US6469302B1 · kind B1 · utility
1Cited by
1References
6Claims
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Key dates
| Filing date | Nov 20, 2000 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Nov 20, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The heat conductance of the heat transfer route through which heat flows into a heat sink from the central region and its neighborhood of an absorbent via the edge region of the absorbent is made to be smaller, by making the absorbent have such a form that the film thickness of the edge region of the pattern of the infrared absorbent formed on the surface of a temperature sensing part is smaller than that of the central region of the pattern. Efficient temperature rise of a temperature sensing part is realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.