Lead frame and method for plating the same
US6469386B1 · kind B1 · utility
12Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2000 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Jan 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame for a semiconductor package and a method for manufacturing the lead frame. In the manufacture of the lead frame, a protective layer is formed with nickel (Ni) or Ni alloy on a metal substrate, an intermediate layer is then formed with palladium (Pd) or Pd alloy on the protective layer. Then, Pd and gold (Au) are alternately plated on the surface of the intermediate layer to form an outermost layer including both Pd and Au particles thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.