Method and apparatus for testing of ball grid array circuitry
US6469530B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2000 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Feb 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A ball grid technology circuit assembly for mounting and connecting a ball grid array circuit package having a grid array of ball pads to a printed circuit board and providing enhanced connections for testing of the ball grid array circuits. The printed circuit board includes a via array of vias wherein each via extends from the upper face of the printed circuit board to a lower face of the printed circuit board and is co-located with a ball pad of the ball grid array to provide a path between the ball pad and the lower end of the via to provide electrical access to the corresponding ball pad. A probe array includes a pin array of probe pins wherein each probe pin is co-located with a via of the via array to provide electrical contact with a ball pad of the ball grid array. The probe array is mounted in a probe block and the probe block and printed circuit board include alignment holes and alignment pins for aligning the probe array with the vias and a probe attachment to secure the probe block to the ball grid array technology circuit assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.