High-frequency interconnection for circuits
US6469592B2 · kind B2 · utility
7Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2001 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Sep 24, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.