Laser capture microdissection method and apparatus
US6469779B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1998 |
| Grant date | Oct 22, 2002 |
| Priority date | — |
| Expiry date | Feb 4, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2001/284
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for laser capture microdissection are disclosed. A method of laser capture microdissection includes providing a sample that is to undergo laser capture microdissection; positioning said sample within an optical axis of a laser capture microdissection instrument; providing a transfer film carrier having a substrate surface and a laser capture microdissection transfer film coupled to said substrate surface; placing said laser capture microdissection transfer film in juxtaposition with said sample with a pressure sufficient to allow laser capture microdissection transfer of a portion of said sample to said laser capture microdissection transfer film, without forcing nonspecific transfer of a remainder of said sample to said laser capture microdisection film; and then transferring a portion of said sample to said laser capture microdissection transfer film, without forcing nonspecific transfer of a remainder of said sample to said laser capture microdissection transfer film. The systems and methods provide the advantages of increased speed and much lower rates of contamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.