Method for facing a substrate
US6470558B1 · kind B1 · utility
9Cited by
18References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1996 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Dec 17, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49888
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of facing a substrate comprises the steps of first welding a body of a hard facing material to the substrate and then filling a space around the body with a molten metal. The method can be used in the hard facing of metal components with, for example, hard facing materials such as tungsten carbide. The substrate can comprise a metal surface, which can, for example, be the surface of any suitable component, tool, or implement subject to wear in use. The method is particularly suitable for hard facing the wear surfaces of components for use in drill strings in down-hole drilling technology, for example, drill stabilizers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.