Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps
US6470594B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2001 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Sep 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/851
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices, wherein the substrate or encapsulation enclosure, or both, contain vent holes and vent hole seal material or wherein the seal material contains gaps prior to spacing the substrate and the encapsulation enclosure within a predetermined range and the gaps are filled in by spreading the sealing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.