Molding method and system with a molding apparatus
US6470953B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2000 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | May 15, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22C15/28
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method and system using a molding apparatus with frames by which the amount of molding sand that overflows the molding apparatus and that must be taken out of a mold that is prepared by a molding operation is minimized, and by which the density of the mold within a frame is substantially uniform. The molding sand filling cavity is defined by a pattern plate, a molding frame that can be put on the pattern plate, a filling frame that can be put on the molding frame, and a covering apparatus having a plurality of squeezing feet. The squeezing feet can enter the filling frame and can be temporarily held at certain positions where certain distances are kept between the lower ends of the squeezing feet and surfaces of the patterns on the pattern plate that are opposed to the lower ends. Molding sand is supplied to the molding sand filling cavity. Then, the molding sand is compressed by the squeezing feet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.