Compositions for use in a chemical-mechanical planarization process
US6471735B1 · kind B1 · utility
10Cited by
12References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2000 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Oct 31, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K13/08
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided are methods for making a slurry composition, suitable for use in a chemical-mechanical planarization process. Also provided are compositions made by such methods. The methods comprise combining: (a) abrasive particles; (b) a suspension medium; (c) a peroxygen compound; (d) an etching agent; and (e) an alkyl ammonium hydroxide. The methods and compositions of the present invention are particularly applicable to the semiconductor manufacturing industry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.