Holder for electroless plating and method of electroless plating
US6471777B1 · kind B1 · utility
53Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1999 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Oct 20, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/163
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells to house each of said plurality of ceramic elements separately, and each of said cells having such a structure as to permit the flow communication of a plating solution into the cell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.