Labeling and manufacturing method utilizing temporary adhesive patches
US6471815B1 · kind B1 · utility
7Cited by
6References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 18, 2001 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Apr 25, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65C11/004
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A labeling and manufacturing method according to which labels are applied to a device utilizing temporary adhesive patches. The patch carrying the label is later removed from the device. The label is separated from the patch, the patch is discarded and the label is permanently attached to the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.