Multi-point compression molding process
US6471902B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 23, 1999 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Dec 23, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/5883
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A multi-point thin portion compression molding method and apparatus in which a plurality of ultra thin portions can be formed by compression molding. Mold apparatuses are opened/close to each other to form a cavity space having a molded material therebetween, at least one movable telescopic member passes through one metal mold and protrudes toward the other metal mold, the central and outer periphery of the telescopic member are provided with vent portions, and recess portions are formed on the metal mold contacting the vent portions to allow molten resin to escape, and the recess portions adjust a pressure applied to the cavity space by the compressing operation of the telescopic member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.