Solid-state imaging device and method of production of the same
US6472247B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2001 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Jun 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a solid-state imaging device and its production method according to the present invention, a solid-state image sensor has an effective light-receiving region on a circuit formation surface provided in a face-down condition. A transparent substrate has a conductor pattern provided thereon to confront the circuit formation surface of the image sensor. A transparent adhesive agent is provided between the image sensor and the substrate and formed into a thin layer, the adhesive agent covering the light-receiving region of the image sensor. A plurality of bumps are provided on one of the image sensor and the substrate to interconnect the image sensor and the conductor pattern of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.