BGA package and method for fabricating the same
US6472732B1 · kind B1 · utility
50Cited by
8References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2000 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Mar 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array (BGA) package includes a substrate (20) having first and second surfaces. and through holes (30) passing through it. The package further includes a first semiconductor chip (28) which is mounted on the first surface of the substrate (20); a second semiconductor chip (36) which is mounted on the second surface of the substrate (20); and solder balls (34) which are provided on the first surface of the substrate (20) and are electrically connected to the first semiconductor chip (28). The second semiconductor chip (36) is electrically connected via the through holes (30) to the solder balls (34).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.