Stacked semiconductor device and method for manufacturing the same
US6472734B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2001 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Mar 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06586
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a first wiring board and a second wiring board, wherein the first wiring board includes a first semiconductor element arranged on the underside of the first wiring board, and a second connecting section formed on the underside of the first wiring board, the second wiring board includes a second semiconductor element, and a third connecting section formed on the surface of the second wiring board, the second connecting section has a first external connecting land, the third connecting section is arranged opposite to the first external connecting land and has a second external connecting land which is smaller than the first external connecting land, and the second and third connecting sections are formed such that a combined thickness thereof provides a given space between the first semiconductor element and the second wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.