Semiconductor device having bonding wires serving as external connection terminals
US6472746B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2001 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Jan 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor element stacking structure, each electrode of each of the stacked semiconductor elements can be drawn out with a simple structure. A plurality of semiconductor elements are arranged in a stacked state, each of the semiconductor elements having a circuit forming surface on which electrodes are formed. A resin layer is formed on the circuit forming surface of each of the semiconductor elements. The resin layer has an outer configuration the same as that of each of the semiconductor elements. A plurality of bonding wires are embedded in the resin layer. One end of the each of the bonding wires is connected to respective one of the electrodes and the other end of each of the bonding wires is exposed on a side surface of the resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.