Plastic encapsulated semiconductor light emitting device with a cover of fluorescent particles
US6472765B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2000 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Nov 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
Abstract
A plastic encapsulated semiconductor light emitting device comprises a plurality of leads 1, 2, one of which is formed with a dished portion 5; a semiconductor light emitting element 3 attached on a bottom surface 6 of the dished portion 5 for electrical connection of the light emitting element across the plurality of leads 1, 2; a plastic encapsulant 9 for sealing each end of the leads 1, 2, and the semiconductor light emitting element 3; a light-permeating cover 20 attached to an outer surface of the plastic encapsulant 9; and fluorescent particles 16 contained in the cover 20. As the number of fluorescent particles 16 at the vertex of the upper portion 22 is larger than that of the fluorescent particles 16 in the cylindrical lower portion 21, the semiconductor light emitting device can emit light with the nearly uniform light wavelength at any angular distance from the central axis of the plastic encapslant 9.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.