RF power amplifier assembly employing multi-layer RF blocking filter
US6473314B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2000 |
| Grant date | Oct 29, 2002 |
| Priority date | — |
| Expiry date | Aug 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H1/0007
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A low cost radio frequency interference filter assembly comprises a multiple layer structure including a middle trace layer disposed between an upper ground layer and lower ground layer. Non-conductive insulation layers are disposed between the middle trace layer and the upper and lower ground layers. The upper layer includes input contacts, signal contacts, and capacitors which are coupled to the signal contacts and an upper grounded substrate. The middle trace layer includes a grounded substrate and trace lines which are coupled to the signal contacts of the upper layer by signal vias. The lower layer includes a grounded substrate. Ground vias are formed through the insulation layers to couple the middle grounded substrate to the upper and lower grounded substrates. The filter assembly may be formed as an integral projection of a printed circuit board assembly. A structure for an RF power amplifier assembly is provided along with methods for manufacturing a filter assembly and assembling an electronics assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.