Method of manufacturing ink-jet printer head
US6473966B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2000 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Jan 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A printer head substrate having a silicon substrate on which heat generating elements and partitions are formed and an orifice plate which adhered to the partitions is placed on a stage of a helicon-wave dry etching system. Helicon-wave dry etching is performed while cooling the printer head substrate by allowing a coolant gas to be intervened between the substrate and the stage. This allows multiple orifices of a desired and adequate shape to be simultaneously and quickly bored in the orifice plate even if a thin film sheet having adhesive layers adhered to both sides thereof is used as the orifice plate, thereby improving the working efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.