Film thickness measuring method, polishing method, fabrication method of thin film magnetic head and substrate for forming the thin film magnetic head
US6475062B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1999 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Dec 13, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a film thickness measuring method measuring a film thickness of an element formation layer formed on a substrate and its object is to provide a film thickness measuring method which can measure a residual film thickness of a polishing object film in a polishing process at a high accuracy. In a fabrication method of a thin film magnetic head, alumina is coated over a dummy layer 54 and a bottom shielding layer 16 after forming the dummy layer 54 along with the bottom shielding layer 16 and a planarized layer 24 is formed by polishing the surface thereof using a CMP. Next, after forming a top shielding layer 32 over the bottom shielding layer 16, a planarized layer 38 is form by embedding alumina. A film thickness of an embedded 38 on the dummy layer 54 is measured by a non-contact optical film thickness measuring equipment and a film thickness of the top shielding layer 32 is measured based on the film thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.