Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
US6475068B1 · kind B1 · utility
7Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2000 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Mar 21, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24C3/322
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.