Conversion coating composition based on nitrogen and silicon compounds and conversion coating method using the same
US6475299B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 7, 2000 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Jul 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/383
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are a conversion coating composition for use in the surface treatment of a PCB and a conversion coating method using the same. The composition comprises 0.1-30 vol % of sulfuric acid; 0.1-15 vol % of hydrogen peroxide; 0.01-10 wt % of an organic acid; 0.1-30 wt % of a nitrogen compound; 0.01-10 wt % of an organic silicate and/or organic titanate; and 0.1-20 wt % of a film forming auxiliary, 0.1-30 wt % of an etching rate controller, 0.1-20 wt % of a reaction promoter and/or 0.1-20 g/l of a stabilizer. This composition is applied to a PCB at 10-60° C. for 1-10 min. The conversion coating film is superb in adhesive strength, acid resistance, and adhesion and can be formed with ease.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.