Electrodeposition method
US6475367B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2000 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Feb 9, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/0657
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is disclosed an electrodeposition method capable of suppressing the drop in the power supply voltage and minimizing the heat loss by the electrodeposition current, thereby achieving uniform film formation with satisfactory characteristics. A conductive substrate is dipped in an electrodeposition bath held in an electrodeposition tank, and an oxide is electrolytically deposited on the conductive substrate. An electricity feed means as at least one electrode of the electrodeposition tank is composed of a conductive member so provided as to be in contact with a back surface of the conductive substrate, wherein the contact position of the electricity feed means and the conductive substrate is outside the electrodeposition bath, and wherein the resistance, including contact resistance, between the closer to the electricity feed means of a position of entry of the conductive substrate into the electrodeposition bath and a position of discharge of the conductive substrate from the electrodeposition bath, and the contact position of the conductive substrate with the electricity feed means is 20&OHgr; or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.