Ink feed channels and heater supports for thermal ink-jet printhead
US6475402B2 · kind B2 · utility
14Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2001 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Mar 2, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1632
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An ink-jet printhead fabrication process and product that uses selectivity rate controlled etch techniques to produce trenches on the frontside of a silicon substrate to define ink feed channels and resistor support regions. Location and size of features is made independent of etch rate by providing a selective etch for the silicon trench etch steps that is greater than 10,000:1 for the silicon:oxide that defines ink feed channels and resistor support areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.