Method of producing thin resin films
US6475571B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2001 |
| Grant date | Nov 5, 2002 |
| Priority date | — |
| Expiry date | Jul 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/18
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for manufacturing a resin thin film of the present invention includes supplying a liquid resin material and a gas to a two-fluid nozzle by pressure; ejecting the resin material in the form of atomized particles toward a heating member by the two-fluid nozzle, thereby adhering the resin material to the heating member; or mixing a liquid resin material with a gas; ejecting the resin material in form of atomized particles toward a heating member that is provided under reduced pressure, thereby adhering the resin material to the heating member; and evaporating the resin material on the heating member to obtain the evaporated resin material. Thus, the present invention can provide a resin thin film having a uniform thickness stably with simple means at a low cost. The resin thin film obtained by the present invention can be used in a wide range, for example a magnetic recording medium such as a magnetic tape, a wrapping material, and an electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.